High performance Copper heatpipes with a fusion bonded copper powder wick. Patented CDC™ technology – 4 direct touch heatpipes creating a gap-less contact surface Aluminum Fin Array with New Tunnel Effect layout for improved heat dissipation. 4th Generation Bearing – MTBF of 160,000 hours thanks to highly durable POM components. Redesigned Fan-blades that create vortices to boost airflow without creating more noise. Smart Fan engine – stops the fan when blocked to prevent damage, and automatically restarts the fan when it has been cleared. Universal mounting system for all Intel and AMD platforms.
Well-balanced cooling performance provides fin optimizations with perfect balance between high and low speed operations 4 Direct Contact heat pipes with the patented CDC(Continuous Direct Contact) technology – creating a perfect, sleek surface for heat conduction Wide-range PWM fan with unique wave-shaped blade design for excellent airflow Versatile all-in-one mounting solution supporting the latest Intel LGA 1366 / 1155 / 1151 / 1150 and AMD FM2 / FM1 / AM3+ Fan Dimensions: 4.7 x 4.7 x 1 inches. Heat Sink Dimensions: 4.6 x 2.0 x 6.3 inches